Discuss the implementation effects of heat pipe radiator technology.
Release time:
2022-07-26 14:19
Source:
The commonly used materials for heat pipe coolers in the market are copper and magnesium-aluminum alloys. These heat sinks typically use a copper metal base, while the heat sink fins are made of magnesium-aluminum alloy. The general structure of a heat pipe cooler involves a pure aluminum radiator that is copper-plated. However, the opening of solar extrusion molds is greatly limited by the extrusion molds, making it impossible to open dense fin-type radiators, resulting in insufficient cooling capacity.
Currently commonly used in the marketHeat pipe radiatorMaterials are copper and magnesium-aluminum alloy. These radiators usually use a copper metal base, and the fins are made of magnesium-aluminum alloy. The general structure of the heat pipe radiator is that the pure aluminum radiator is treated with copper plating. However, the opening of solar extrusion molds is greatly limited by the extrusion molds, making it impossible to open dense fin-type radiators, resulting in insufficient cooling capacity. Solar drawing molds often experience damage during processing, affecting product delivery times. Copper plug technology is a stamping skill that easily damages the appearance during the processing. Over time, the pollution bacteria in the built-in radiator become too many, so let's understand the implementation effect of heat pipe radiators.
The heat pipe radiator consists of an upper water chamber, a lower water chamber, a radiator core (composed of cooling pipes and fins stacked together), a water inlet, a cover, a drainage switch, a steam outlet pipe, and a bracket.
The main components of the heat pipe radiator are made of brass, formed by stacking cooling pipes and fins. The radiator core can be either tube-sheet type (fins arranged transversely on the cooling pipes) or tube-belt type (wavy fins stacked against the side walls of the cooling pipes).
The beneficial effect of the heat pipe radiator is achieved through cylindrical welding, which greatly improves the cooling capacity of the heat pipe radiator. The provided heat is 15% more than that of traditional radiators and can be used for high-heat-generating electronic devices. The utility model's stamping die has a long service life without delivery delays; the use of welding technology ensures appearance quality; stability, reliability, ease of operation, novel design, strong practicality, and ease of promotion.
Technical characteristics of heat pipe radiators:
The shape of the fins in heat pipe radiators is designed to increase the heat dissipation area to facilitate radiation and convection cooling. An important indicator is the heat dissipation area, but the cooling effect varies in different parts. The fins consist of multiple fins arranged continuously in the circumferential direction, closely connected on the outer surface and fixed as one unit in a claw shape, with holes suitable for the heat dissipation column set at the center position.
The lower end of the heat pipe radiator is equipped with a ring made of flexible material that is forcibly pressed into the hole of the base, fitting between the lower and upper surfaces of the fins. The material of the heat pipe radiator refers to the specific materials used for the fins. Each material has different thermal conductivity properties, arranged from high to low thermal conductivity as follows: silver, copper, aluminum, steel. However, using silver for fins would be too expensive; copper is recommended instead. Although aluminum is much cheaper, its thermal conductivity is obviously not as good as that of copper. Therefore, heat pipe radiators are made lighter, increase heat dissipation surface area, have good thermal effects, and are thus favored by many.
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Application fields of heat sinks
As an indispensable part of the thermal management system, radiators have a wide range of applications.
How much do you know about finned heat sinks?
The characteristics of finned heat sinks are that the fins break through the original proportional limitations, resulting in good heat dissipation effects, and different materials can be used to make the fins. The drawbacks are also quite obvious, as the heat sink and the base are bonded with thermal paste and solder, which can cause interface resistance issues that affect heat dissipation. To improve these shortcomings, two new technologies have been applied in the field of heat sinks.
Introduction to the characteristics of finned heat sinks.
The finned heat sink is a device used for electronic components that are prone to heating in electrical appliances. It is made of aluminum alloy, yellow or bronze, and comes in plate, sheet, or multi-sheet shapes. For example, the CPU in a computer requires a considerable size, and the power tubes, line tubes, and amplifier tubes in televisions all need to dissipate heat. Typically, a layer of thermal grease should be applied to the contact surface of the electronic components to more effectively conduct the heat generated by the components, which is then dissipated into the surrounding air.
Introduction to the advantages of finned heat sinks
The finned heat sink primarily achieves heat dissipation through conduction, involving dielectric heat sinks that are in direct contact with the processor. After absorbing heat, it dissipates through convection. During the convection process, the area is mainly determined by the surface area of the fins. Common methods used in the industry include: increasing the number of fins and increasing the length of the fins. One of the reflected data points is the 'thickness ratio', which is the ratio of fin thickness to its height.
Introduction to finned heat sinks
The finned heat sink primarily achieves heat dissipation through conduction, involving a medium heat sink that is in direct contact with the processor. After absorbing heat, the heat sink dissipates it through convection. In the convection heat dissipation process, the heat dissipation area is mainly determined by the surface area of the heat dissipation fins. The larger the surface area, the better the heat dissipation effect. The smaller the surface area, the worse the heat dissipation effect.
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