Introduction to the characteristics of finned heat sinks.


The finned heat sink is a device used for electronic components that are prone to heating in electrical appliances. It is made of aluminum alloy, yellow or bronze, and comes in plate, sheet, or multi-sheet shapes. For example, the CPU in a computer requires a considerable size, and the power tubes, line tubes, and amplifier tubes in televisions all need to dissipate heat. Typically, a layer of thermal grease should be applied to the contact surface of the electronic components to more effectively conduct the heat generated by the components, which is then dissipated into the surrounding air.

  Fin radiatorIt is a device that is prone to heating among electrical appliances, made of aluminum alloy, yellow or bronze, and shaped like a plate, sheet, or multiple sheets. For example, the CPU in a computer requires considerable heat dissipation, and the power tubes, line tubes, and amplifier tubes in televisions also need to dissipate heat. Typically, a layer of thermal grease should be applied to the contact surface of the electronic components to more effectively conduct the heat generated by the components, which is then dissipated into the surrounding air.

Currently commonly used materials include copper and aluminum alloy, each with its advantages and disadvantages. Copper has good thermal conductivity but is expensive, difficult to process, heavy, has a small heat capacity, and is prone to oxidation. However, pure aluminum is too soft for direct use; only used aluminum can provide sufficient hardness. The advantage is that it is low-cost and lightweight, but its thermal conductivity is much worse than that of copper.

For components that generate a lot of heat, aluminum can be used to dissipate heat because it does not achieve the same effect as copper. This is an inherent advantage due to its large heat capacity. The fins made from this material absorb heat quickly and release it slowly. There is a significant physical deposition of heat within the fins, requiring high-power and high-speed fans to achieve optimal performance.

Although fin radiators absorb heat slowly, they release heat quickly, which is proportional to their structure and workmanship. The more fins there are, the better the smoothness at the bottom. However, it is also limited by its manufacturing process. Generally, the groove spacing achieved by aluminum extrusion manufacturing can only reach 1.1mm; the principle is simple: increase the contact area with air and then use fans to accelerate airflow to carry away heat. Aluminum fins have a small heat capacity, allowing devices to operate better at a much lower cost than copper fins.

Both have their advantages and disadvantages. They have good thermal conductivity but are expensive, difficult to process, too heavy, and prone to oxidation. However, pure aluminum is too soft for direct use; only used aluminum can provide sufficient hardness. The advantage is that it is low-cost and lightweight but has much poorer thermal conductivity than copper. Some radiators have their own pros and cons with a plate embedded in the base.

The fin radiator lamp cup is effective in reducing light decay and extending the lifespan of lighting fixtures. It is made from 1050/1100 high-purity aluminum plates stamped into shape, paired with a revolutionary ultra-thin fin wind tunnel design. It has a high safety factor; the lamp head features a novel flexible design compatible with universal E27, MR16, GU10 bases. The lens angle can be flexibly matched for easy installation; it is formed by folding thin sheets of copper or aluminum into one piece using a forming machine and then fixed with upper and lower base plates through punching molds before being combined with the processed base using a high-frequency metal welder. Due to the continuous bonding process, it is suitable for making fins with high aspect ratios; since it is one-piece formed, it benefits thermal conductivity continuity. With a thickness of only 0.1mm, it can significantly reduce material requirements while allowing for larger sizes within permissible weight limits.

 

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Application fields of heat sinks

As an indispensable part of the thermal management system, radiators have a wide range of applications.


How much do you know about finned heat sinks?

The characteristics of finned heat sinks are that the fins break through the original proportional limitations, resulting in good heat dissipation effects, and different materials can be used to make the fins. The drawbacks are also quite obvious, as the heat sink and the base are bonded with thermal paste and solder, which can cause interface resistance issues that affect heat dissipation. To improve these shortcomings, two new technologies have been applied in the field of heat sinks.


Introduction to the characteristics of finned heat sinks.

The finned heat sink is a device used for electronic components that are prone to heating in electrical appliances. It is made of aluminum alloy, yellow or bronze, and comes in plate, sheet, or multi-sheet shapes. For example, the CPU in a computer requires a considerable size, and the power tubes, line tubes, and amplifier tubes in televisions all need to dissipate heat. Typically, a layer of thermal grease should be applied to the contact surface of the electronic components to more effectively conduct the heat generated by the components, which is then dissipated into the surrounding air.


Introduction to the advantages of finned heat sinks

The finned heat sink primarily achieves heat dissipation through conduction, involving dielectric heat sinks that are in direct contact with the processor. After absorbing heat, it dissipates through convection. During the convection process, the area is mainly determined by the surface area of the fins. Common methods used in the industry include: increasing the number of fins and increasing the length of the fins. One of the reflected data points is the 'thickness ratio', which is the ratio of fin thickness to its height.


Introduction to finned heat sinks

The finned heat sink primarily achieves heat dissipation through conduction, involving a medium heat sink that is in direct contact with the processor. After absorbing heat, the heat sink dissipates it through convection. In the convection heat dissipation process, the heat dissipation area is mainly determined by the surface area of the heat dissipation fins. The larger the surface area, the better the heat dissipation effect. The smaller the surface area, the worse the heat dissipation effect.

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