The technical implementation effects of finned heat sinks.
Release time:
2022-08-03 17:30
Source:
The commonly used materials for finned heat sinks in the market are copper and magnesium-aluminum alloys. These heat sinks typically have a copper metal base, while the fins are made of magnesium-aluminum alloy. The general structure of a finned heat sink involves copper plating on pure aluminum heat sinks. However, the mold for solar extrusion profiles is significantly limited by the extrusion mold, making it impossible to create dense finned heat sinks, resulting in insufficient heat dissipation capacity. Additionally, solar deep-drawing molds often experience damage during processing, affecting product delivery times. The copper plug technology is a stamping technique that can easily damage the appearance during processing. Over time, the built-in heat sinks can become contaminated with excessive bacteria. Below, we will explore finned heat sinks.
Currently commonly used in the marketFin heat sinkThe materials are copper and magnesium-aluminum alloy. These heat sinks usually use a copper metal base, while the heat sink fins are made of magnesium-aluminum alloy. The general structure of the fin heat sink is that the pure aluminum heat sink is treated with copper plating. However, the mold for solar extrusion profiles is greatly limited by the extrusion mold, making it impossible to open dense fin heat sinks, resulting in insufficient heat dissipation capacity; solar deep-drawing molds often suffer from damage during processing, affecting product delivery times; copper plug technology is a stamping technology that easily damages the appearance during processing; as the service life increases, the built-in heat sink becomes contaminated with excessive bacteria. Let's understand the technical implementation effects of fin heat sinks.
To address the shortcomings of existing technology, a fin heat sink is provided, which includes: a heat dissipation column, which is cylindrical and made of copper material; fins, which include multiple fins arranged continuously around the outer circumference of the heat dissipation column, with the outer surface of the fin heat sink being closely bonded and integrally fixed to the inner surface of the fins; a base, which is claw-shaped and has a perforation suitable for the heat dissipation column at its center position, with a fan also provided on one side of the fins. The fan consists of multiple fan blades, and the surface of the fan blades is covered with a nano self-cleaning coating.
The lower end of the heat dissipation column is equipped with a ring made of flexible material as a positioning ring, which is forcibly pressed into the perforation of the base through the positioning ring. The base is engaged between the lower surface of the fins and the upper surface of the positioning ring, allowing the heat dissipation column and fins to rotate circumferentially relative to the base. The outer surface of the fins is recessed inward to form an annular buckle.
The beneficial effects of the fin heat sink are: using a cylindrical fin welded to a solid copper column significantly improves the heat dissipation capacity of the radiator; this radiator's heat dissipation capacity is 15% higher than that of traditional radiators and can be used for electronic devices with stronger heating power; the stamping mold used for fins in this utility model has a long lifespan without delivery delays; using welding technology ensures appearance quality; it has good stability, high reliability, convenient operation, novel design, strong practicality, and is easy to promote and apply.
Technical features of fin heat sinks:
The fin heat sink is characterized by having a cylindrical heat dissipation column: The heat dissipation column is made of copper; fins include: multiple fins arranged continuously around the outer circumference of the heat dissipation column, with their outer surfaces closely bonded and integrally fixed to their inner surfaces; the base is claw-shaped, with a perforation suitable for the heat dissipation column at its center position.
The lower end of the fin heat sink is equipped with a ring made of flexible material as a positioning ring, which is forcibly pressed into the perforation of the base through this positioning ring. The base engages between the lower surface of the fins and the upper surface of the positioning ring, as well as between the upper surface of the heat dissipation column and positioning ring.
Related News
Applications and Prospects of Fin Heat Sinks in Electronics
Explore the importance of fin heat sinks in modern electronic devices and their future development trends.
Application fields of heat sinks
As an indispensable part of the thermal management system, radiators have a wide range of applications.
How much do you know about finned heat sinks?
The characteristics of finned heat sinks are that the fins break through the original proportional limitations, resulting in good heat dissipation effects, and different materials can be used to make the fins. The drawbacks are also quite obvious, as the heat sink and the base are bonded with thermal paste and solder, which can cause interface resistance issues that affect heat dissipation. To improve these shortcomings, two new technologies have been applied in the field of heat sinks.
Introduction to the characteristics of finned heat sinks.
The finned heat sink is a device used for electronic components that are prone to heating in electrical appliances. It is made of aluminum alloy, yellow or bronze, and comes in plate, sheet, or multi-sheet shapes. For example, the CPU in a computer requires a considerable size, and the power tubes, line tubes, and amplifier tubes in televisions all need to dissipate heat. Typically, a layer of thermal grease should be applied to the contact surface of the electronic components to more effectively conduct the heat generated by the components, which is then dissipated into the surrounding air.
Introduction to the advantages of finned heat sinks
The finned heat sink primarily achieves heat dissipation through conduction, involving dielectric heat sinks that are in direct contact with the processor. After absorbing heat, it dissipates through convection. During the convection process, the area is mainly determined by the surface area of the fins. Common methods used in the industry include: increasing the number of fins and increasing the length of the fins. One of the reflected data points is the 'thickness ratio', which is the ratio of fin thickness to its height.
Introduction to finned heat sinks
The finned heat sink primarily achieves heat dissipation through conduction, involving a medium heat sink that is in direct contact with the processor. After absorbing heat, the heat sink dissipates it through convection. In the convection heat dissipation process, the heat dissipation area is mainly determined by the surface area of the heat dissipation fins. The larger the surface area, the better the heat dissipation effect. The smaller the surface area, the worse the heat dissipation effect.
Privacy Policy | SEO | CitySite | Support:300.cn Dongguan