Knowledge related to finned heat exchangers
Release time:
2022-12-14 14:19
Source:
The characteristics of finned heat sinks are that the fins break through the original proportional limitations, resulting in good heat dissipation, and they can also be made from different materials. Of course, the drawbacks are also quite obvious, as the interface resistance issue caused by the thermal paste and solder bonding between the heat sink and the base can affect heat dissipation. To improve these shortcomings, two new technologies have been applied in the field of heat sinks.
Fin radiatorThe characteristic of the fin radiator is that the fins break through the original proportional limitations, have good heat dissipation effects, and can be made with different materials. Of course, the drawbacks are also very obvious, as the interface resistance problem caused by using thermal paste and solder to bond the heat sink and base affects heat dissipation. To improve these shortcomings, two new technologies have been applied in the field of radiators.
The first is the tooth insertion technology, which combines aluminum plates with copper bases under a pressure of over 60 tons, with no medium between aluminum and copper. At a microscopic level, the atoms of aluminum and copper are interconnected to a certain extent, thus completely avoiding the interface thermal resistance issues caused by traditional copper-aluminum bonding, greatly improving the thermal conductivity of the product.
The second is reflow soldering technology. The main issue with traditional bonded heat sinks is interface resistance, and reflow soldering technology is an improvement on this problem. In fact, the reflow soldering process is almost identical to that of traditional bonded heat sinks, except that it uses a specialized reflow soldering furnace that can precisely set welding temperature and time parameters. The solder used is a lead-tin alloy, which allows for full contact between the welded metals, avoiding missed or weak solder joints, ensuring that the connection between fins and base is as tight as possible, greatly reducing interface thermal resistance, controlling the melting time and temperature of soldered copper at each joint, and ensuring uniformity across all solder points.
Compared to aluminum extruded heat sinks, cutting technology solves the limitation of aspect ratio for heat sink fins. The cutting process uses a special tool to cut the entire material into layers of fins. The fins can be as thin as 0.5mm, and the fins of the fin radiator and base are integrated, eliminating interface resistance issues. However, due to high waste generation and low yield during production, this cutting process has a higher cost; therefore, it mainly leans towards copper heat sinks.
The fin radiator is formed by folding thin sheets of copper or aluminum into integrated fins using a forming machine. It then fixes the upper and lower plates with a punching die and combines them with a processed base using a high-frequency metal welding machine. Since the process involves continuous bonding, it is suitable for making fins with high aspect ratios. Additionally, because the fins are integrally formed, it benefits thermal conductivity continuity. The thickness of the fins is only 0.1mm, which can significantly reduce material requirements while allowing for larger sizes within the permissible weight range of the fins.
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How much do you know about finned heat sinks?
The characteristics of finned heat sinks are that the fins break through the original proportional limitations, resulting in good heat dissipation effects, and different materials can be used to make the fins. The drawbacks are also quite obvious, as the heat sink and the base are bonded with thermal paste and solder, which can cause interface resistance issues that affect heat dissipation. To improve these shortcomings, two new technologies have been applied in the field of heat sinks.
Introduction to the characteristics of finned heat sinks.
The finned heat sink is a device used for electronic components that are prone to heating in electrical appliances. It is made of aluminum alloy, yellow or bronze, and comes in plate, sheet, or multi-sheet shapes. For example, the CPU in a computer requires a considerable size, and the power tubes, line tubes, and amplifier tubes in televisions all need to dissipate heat. Typically, a layer of thermal grease should be applied to the contact surface of the electronic components to more effectively conduct the heat generated by the components, which is then dissipated into the surrounding air.
Introduction to the advantages of finned heat sinks
The finned heat sink primarily achieves heat dissipation through conduction, involving dielectric heat sinks that are in direct contact with the processor. After absorbing heat, it dissipates through convection. During the convection process, the area is mainly determined by the surface area of the fins. Common methods used in the industry include: increasing the number of fins and increasing the length of the fins. One of the reflected data points is the 'thickness ratio', which is the ratio of fin thickness to its height.
Introduction to finned heat sinks
The finned heat sink primarily achieves heat dissipation through conduction, involving a medium heat sink that is in direct contact with the processor. After absorbing heat, the heat sink dissipates it through convection. In the convection heat dissipation process, the heat dissipation area is mainly determined by the surface area of the heat dissipation fins. The larger the surface area, the better the heat dissipation effect. The smaller the surface area, the worse the heat dissipation effect.
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