Introduction to the principle of heat pipe module coolers
Release time:
2022-11-11 11:31
Source:
The heat pipe module cooler consists of a sealed tube, a liquid-absorbing core, and a vapor channel. The liquid-absorbing core is actually wrapped around the wall of the sealed tube and is soaked with a volatile saturated liquid. If it is to be used, it is important to know that this liquid can be distilled water, ammonia, methanol, etc. Heat pipe coolers filled with liquids such as ammonia and methanol still have excellent cooling capabilities at low temperatures.
Heat pipe module coolerIt consists of a sealed tube, a liquid-absorbing core, and a vapor channel. The liquid-absorbing core is wrapped around the wall of the sealed tube and is soaked with a volatile saturated liquid. This liquid can be distilled water, ammonia, methanol, etc. Heat pipe coolers filled with ammonia, methanol, and other liquids still have good cooling capabilities at low temperatures.
When the heat pipe module cooler is operating, its evaporation section absorbs heat generated by the heat source (such as power semiconductor devices), causing the liquid in the liquid-absorbing core to boil into vapor. The vapor carrying heat moves from the evaporation section of the heat pipe cooler to its cooling section. At this point, if the vapor transfers heat to the cooling section, it will condense back into liquid. The condensed liquid returns to the evaporation section through capillary action in the tube wall, repeating the above cycle and continuously dissipating heat. In summary, this heat pipe module cooler is an efficient cooler with unique heat dissipation characteristics. It has a high thermal conductivity, and the temperature distribution along the axial direction of its evaporation and cooling sections is uniform and basically equal. Additionally, the thermal resistance of the heat pipe module cooler is determined by the thermal conductivity of the material and the effective area within its volume. When the volume of a solid aluminum or copper cooler reaches 0.006m, it cannot significantly reduce thermal resistance by simply increasing its volume and area.
For discrete semiconductor devices with dual-side cooling, the thermal resistance of air-cooled full copper or full aluminum heat sinks can only reach 0.04℃/W. The thermal resistance of heat pipe coolers can reach 0.01℃/W. Under natural convection cooling conditions, the performance of heat pipe module coolers is more than ten times better than that of solid coolers. Moreover, they have a fast thermal response speed and a heat transfer capability that is over 1000 times greater than that of copper pipes of equivalent size and weight; they are compact and lightweight; and importantly, they have high cooling efficiency, which can simplify the cooling design of electronic devices, such as changing from air cooling to self-cooling; they do not require an external power supply and do not need special maintenance during operation; especially since heat pipe module coolers also have good isothermal performance. After thermal equilibrium, the temperature gradient between the evaporation section and cooling section is very small and can be approximated as zero; furthermore, their operation is safe and reliable without polluting the environment.
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