Yongya Hardware Electronics Co., Ltd. is a Sino-foreign joint venture.
Release time:
2021-10-09 10:18
Source:
Yongya Hardware Electronics Co., Ltd. is a Sino-foreign joint venture located in the Wanjiang Industrial City of Dongguan, with very convenient transportation. The company was established in 1997 and has rapidly developed over the years, now possessing fixed assets of 25 million Hong Kong dollars. The factory covers an area of 25,000 square meters, with fragrant flowers and an elegant environment, and work is conducted in a meticulous and orderly manner. The company mainly produces various aluminum profiles, speaker DVD front panels, and various heat sinks for computers and audio equipment. This company integrates mold design, development, and systematization, with strong technical capabilities and advanced machining and production equipment; it has rich experience in hardware.
Yongya Hardware Electronics Co., Ltd. is a Sino-foreign joint venture located in the Wanjiang Industrial City of Dongguan, with very convenient transportation. The company was established in 1997 and has rapidly developed over the years, now possessing fixed assets of 25 million Hong Kong dollars. The factory covers an area of 25,000 square meters, with fragrant flowers and an elegant environment, and work is orderly and diligent.
The company mainly produces various aluminum profiles, speaker DVD front panels, and various heat sinks for computers and audio equipment.
Our company integrates mold design, development, and systematization, with strong technical capabilities and advanced machining and production equipment; we have rich experience in hardware product manufacturing; we have sufficient capacity for hardware product processing, making us one of the fastest-growing hardware product factories in the Dongguan area.
The company's operators focus on the future, pay attention to learning advanced management practices, introduce advanced technology, and emphasize the cultivation of talent skills. The company has fully established the ISO9001:2000 quality management system. We have always adhered to the principle of 'customer-centric, continuous improvement, striving for excellence, total quality management, and on-time delivery' to meet the growing quality demands, technical needs, high-quality, low-cost services for our customers, achieving satisfaction and praise from most customers.
We firmly believe that our quality can make you 100% satisfied, and our products can make you 100% assured. We look forward to long-term cooperation with you to create a better future together.
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Explore the importance of fin heat sinks in modern electronic devices and their future development trends.
Application fields of heat sinks
As an indispensable part of the thermal management system, radiators have a wide range of applications.
How much do you know about finned heat sinks?
The characteristics of finned heat sinks are that the fins break through the original proportional limitations, resulting in good heat dissipation effects, and different materials can be used to make the fins. The drawbacks are also quite obvious, as the heat sink and the base are bonded with thermal paste and solder, which can cause interface resistance issues that affect heat dissipation. To improve these shortcomings, two new technologies have been applied in the field of heat sinks.
Introduction to the characteristics of finned heat sinks.
The finned heat sink is a device used for electronic components that are prone to heating in electrical appliances. It is made of aluminum alloy, yellow or bronze, and comes in plate, sheet, or multi-sheet shapes. For example, the CPU in a computer requires a considerable size, and the power tubes, line tubes, and amplifier tubes in televisions all need to dissipate heat. Typically, a layer of thermal grease should be applied to the contact surface of the electronic components to more effectively conduct the heat generated by the components, which is then dissipated into the surrounding air.
Introduction to the advantages of finned heat sinks
The finned heat sink primarily achieves heat dissipation through conduction, involving dielectric heat sinks that are in direct contact with the processor. After absorbing heat, it dissipates through convection. During the convection process, the area is mainly determined by the surface area of the fins. Common methods used in the industry include: increasing the number of fins and increasing the length of the fins. One of the reflected data points is the 'thickness ratio', which is the ratio of fin thickness to its height.
Introduction to finned heat sinks
The finned heat sink primarily achieves heat dissipation through conduction, involving a medium heat sink that is in direct contact with the processor. After absorbing heat, the heat sink dissipates it through convection. In the convection heat dissipation process, the heat dissipation area is mainly determined by the surface area of the heat dissipation fins. The larger the surface area, the better the heat dissipation effect. The smaller the surface area, the worse the heat dissipation effect.
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