Method for making finned heat exchangers
Release time:
2022-04-18 16:48
Source:
www.winasia.cn
A type of finned heat sink for laptops, installed within the laptop chassis and located between the air outlet of the chassis and the fan, includes a heat sink body, a boss set on the upper surface of the heat sink body, and a cold air passage formed between the upper surface of the heat sink body and the chassis where its upper end contacts or is close to the chassis. The finned heat sink has a simple structure, facilitating rapid airflow of cold air, and is designed for use with laptops. It can quickly reduce the temperature impact of the high-temperature heat sink body on the upper casing of the laptop, ensuring that the laptop meets safety standards while increasing design costs. Below is an overview of the manufacturing method for the finned heat sink.
A type of heat sink installed inside the laptop chassis, located between the outlet of the chassis and the fan.Fin heat sink, including the main body of the heat sink, a boss set on the upper surface of the heat sink main body, and its upper end in contact with or close to the chassis, forming a cold air passage between the upper surface of the heat sink main body and the chassis.Fin heat sinkThe structure is simple, facilitating rapid flow of cold air, compatible with laptops, and can quickly reduce the temperature impact of the high-temperature heat sink main body on the upper casing, meeting laptop safety standards and increasing design costs. Let's understand theFin heat sinkmanufacturing method.
Currently, when designing laptops, in order to reflect a perfect appearance, high specifications, and good thermal performance design, the design departments of various components need to coordinate with each other to meet the requirements for the design of the heat dissipation module's outlet area.
However, when designing the outlet area of the heat dissipation module, there often occurs interaction between departments. Generally speaking, the heat dissipation area of the outlet of the heat dissipation module is close to the upper chassis, and the surface temperature of the upper chassis in the outlet area exceeds the reference value. Therefore, reducing the height of the heat sink to lower the surface temperature of the upper chassis may require adding a piece of sponge to avoid exceeding safety standards, but this method will reduce the performance of the heat dissipation module and lead to an increase in laptop prices; secondly, if a copper foil is added to cool down in the upper casing far from the outlet area, it will similarly lead to price increases.
Fin heat sinkThe purpose is to overcome the above problems by providing a laptop heat sink that has a simple structure, allows cold air to flow quickly, is compatible with laptops, can quickly reduce the temperature impact of high-temperature heat sink main body on the upper casing, meets laptop safety standards, can increase design costs, and add other components for heat dissipation.
LaptopFin heat sink,Fin heat sinkThe upper surface of the main body is equipped with a boss that forms a cold channel between it and the casing, effectively reducing the impact of high-temperature heat sink main body on the upper casing; by setting multiple heat dissipation windows on the boss that connect cold air passages and outlets, allowing cold air expelled by fans to exchange heat with areas near these windows through cold air passages.Fin heat sinkThis compensates for
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How much do you know about finned heat sinks?
The characteristics of finned heat sinks are that the fins break through the original proportional limitations, resulting in good heat dissipation effects, and different materials can be used to make the fins. The drawbacks are also quite obvious, as the heat sink and the base are bonded with thermal paste and solder, which can cause interface resistance issues that affect heat dissipation. To improve these shortcomings, two new technologies have been applied in the field of heat sinks.
Introduction to the characteristics of finned heat sinks.
The finned heat sink is a device used for electronic components that are prone to heating in electrical appliances. It is made of aluminum alloy, yellow or bronze, and comes in plate, sheet, or multi-sheet shapes. For example, the CPU in a computer requires a considerable size, and the power tubes, line tubes, and amplifier tubes in televisions all need to dissipate heat. Typically, a layer of thermal grease should be applied to the contact surface of the electronic components to more effectively conduct the heat generated by the components, which is then dissipated into the surrounding air.
Introduction to the advantages of finned heat sinks
The finned heat sink primarily achieves heat dissipation through conduction, involving dielectric heat sinks that are in direct contact with the processor. After absorbing heat, it dissipates through convection. During the convection process, the area is mainly determined by the surface area of the fins. Common methods used in the industry include: increasing the number of fins and increasing the length of the fins. One of the reflected data points is the 'thickness ratio', which is the ratio of fin thickness to its height.
Introduction to finned heat sinks
The finned heat sink primarily achieves heat dissipation through conduction, involving a medium heat sink that is in direct contact with the processor. After absorbing heat, the heat sink dissipates it through convection. In the convection heat dissipation process, the heat dissipation area is mainly determined by the surface area of the heat dissipation fins. The larger the surface area, the better the heat dissipation effect. The smaller the surface area, the worse the heat dissipation effect.
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