Fin heat sink manufacturing technology
Release time:
2022-04-02 12:33
Source:
www.winasia.cn
During the development of high-power, high-performance lighting, the finned heat sink has shown its shortcomings. As the diameter of the lamp increases, the mold costs also rise. With the increase in lamp power, both the length and weight of the lamp increase as well. Let's take a look at the manufacturing technology of finned heat sinks.
When developing high-power, high-performance lighting,fin heat sinkits shortcomings have been revealed. As the diameter of the lamp increases, the cost of molds also rises; as the power of the lamp increases, both the length and weight of the lamp increase. Let's understand the manufacturing technology of fin heat sinks.
Traditional fin heat sinks often use an integrated structure between the fins and the base plate, which is complex in process, high in production cost, and inconvenient for disassembly and maintenance. In addition, dust can easily accumulate between the traditional fin heat sink and the fins, directly affecting the heat dissipation efficiency of the heat sink.
The fin heat sink is equipped with a heat dissipation section at the top of the main body of the fins, with a snap joint between the heat dissipation section and the main body of the fins. A support block is correspondingly set at the top of the main body of the fins and at the position of the snap joint; at least one fitting protrusion is set at the bottom of the main body of the fins, and a second support block is also set at the bottom of the main body of the fins, with the front end of the second support block coplanar with that of the fitting protrusion.
Both support blocks are perpendicular to the plane where the main body of the fins is located. A dustproof plate is set on the outer side of the main body of the fins, which is also perpendicular to that plane, and at least one heat dissipation hole is provided on the dustproof plate.
The beneficial effects of the fin heat sink are:
1) The use of a plug-in structure to connect the base plate and fixed plate makes disassembly, maintenance, and transportation convenient.
2) The first support block and second support block can effectively support the fins, making their connection to both base plate and fixed plate more secure.
3) The dustproof plate can effectively prevent dust in the air from adhering to gaps in the fins, ensuring good thermal conductivity efficiency for them.
4) The dustproof plate has multiple heat dissipation holes, further ensuring the heat dissipation efficiency of the heat sink.
Integrated light sources on the market are packaged on an aluminum (copper) substrate with thermal paste applied on its back side, attached to a fin heat sink for thermal conduction. While lighting up, thermal energy released from chips makes it difficult for aluminum (copper) substrates to meet temperature loads; during this process, thermal transfer is insufficiently conducted indirectly, thus accelerating chip degradation. Additionally, processes like aluminum (copper) substrates and thermal paste incur costs.
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How much do you know about finned heat sinks?
The characteristics of finned heat sinks are that the fins break through the original proportional limitations, resulting in good heat dissipation effects, and different materials can be used to make the fins. The drawbacks are also quite obvious, as the heat sink and the base are bonded with thermal paste and solder, which can cause interface resistance issues that affect heat dissipation. To improve these shortcomings, two new technologies have been applied in the field of heat sinks.
Introduction to the characteristics of finned heat sinks.
The finned heat sink is a device used for electronic components that are prone to heating in electrical appliances. It is made of aluminum alloy, yellow or bronze, and comes in plate, sheet, or multi-sheet shapes. For example, the CPU in a computer requires a considerable size, and the power tubes, line tubes, and amplifier tubes in televisions all need to dissipate heat. Typically, a layer of thermal grease should be applied to the contact surface of the electronic components to more effectively conduct the heat generated by the components, which is then dissipated into the surrounding air.
Introduction to the advantages of finned heat sinks
The finned heat sink primarily achieves heat dissipation through conduction, involving dielectric heat sinks that are in direct contact with the processor. After absorbing heat, it dissipates through convection. During the convection process, the area is mainly determined by the surface area of the fins. Common methods used in the industry include: increasing the number of fins and increasing the length of the fins. One of the reflected data points is the 'thickness ratio', which is the ratio of fin thickness to its height.
Introduction to finned heat sinks
The finned heat sink primarily achieves heat dissipation through conduction, involving a medium heat sink that is in direct contact with the processor. After absorbing heat, the heat sink dissipates it through convection. In the convection heat dissipation process, the heat dissipation area is mainly determined by the surface area of the heat dissipation fins. The larger the surface area, the better the heat dissipation effect. The smaller the surface area, the worse the heat dissipation effect.
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